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ESD7371XV2T1G - onsemi

Description: Stand−off Voltage: 5.3 V; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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ESD7371XV2T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - ESD7371XV2T1G
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ESD7371XV2T1G Details

  • Manufacturer Part Number:

    ESD7371XV2T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOD-523-2

  • Package Description:

    SOD-523, 2 PIN

  • Manufacturer Package Code:

    502

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Min:

    7 V

  • Clamping Voltage-Max:

    14 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    5.3 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    5.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD7371XV2T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal ESD protection involves placing the ESD7371XV2T1G close to the connector or interface it is protecting, using short traces, and minimizing the distance between the device and the protected circuit. Additionally, a solid ground plane and a low-impedance path to ground can help to reduce the risk of ESD damage.
  • To choose the right ESD protection device, consider the following factors: the type and level of ESD protection required, the operating voltage and current of the circuit, the package type and size, and the environmental conditions in which the device will operate. The ESD7371XV2T1G is a general-purpose ESD protection device suitable for most applications, but onsemi offers a range of devices with different characteristics to suit specific needs.
  • The maximum allowable voltage for the ESD7371XV2T1G is 3.6V. Exceeding this voltage may damage the device or affect its performance. It is essential to ensure that the voltage applied to the device does not exceed this maximum rating.
  • The ESD7371XV2T1G is designed to withstand multiple ESD strikes without degradation or failure. The device's internal protection mechanisms, such as its surge protection and overvoltage protection, help to ensure that it can continue to operate effectively even after multiple ESD events.
  • The ESD7371XV2T1G is rated for operation up to 125°C, making it suitable for use in high-temperature applications. However, it is essential to ensure that the device is properly derated for temperature to prevent overheating and ensure reliable operation.

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ESD7371XV2T1G Overview

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