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ESD7551N2T5G - onsemi

Description: Stand−off Voltage: 3.3 V; Low Leakage: <1µA; IEC61000−4−2 Level 4 ESD Protection; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant; Ultra−Low Capacitance (0.35 pF Max); Low Clamping Voltage; Response Time is < 1 ns; Low Dynamic Resistance < 1 Ω; SZESD7551MXWT5G Wettable Flank Package

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PCB Footprints
ESD7551N2T5G - onsemi PCB footprint - Other - Other - X2DFN2 1.0x0.6, 0.65P CASE-714AB ISSUE B
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ESD7551N2T5G - onsemi  - 3D model - Other - X2DFN2 1.0x0.6, 0.65P CASE-714AB ISSUE B
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ESD7551N2T5G Details

  • Manufacturer Part Number:

    ESD7551N2T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X2DFN-2

  • Package Description:

    X2DFN2, 2 PIN

  • Manufacturer Package Code:

    714AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, ULTRA LOW CAPACITANCE

  • Breakdown Voltage-Max:

    7.5 V

  • Breakdown Voltage-Min:

    5 V

  • Breakdown Voltage-Nom:

    6 V

  • Clamping Voltage-Max:

    13 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD7551N2T5G Frequently Asked Questions (FAQs)

  • A good PCB layout for ESD7551N2T5G involves keeping the device close to the protected line, using short traces, and minimizing the distance between the device and the connector. A ground plane is also recommended to reduce noise and improve performance.
  • The recommended capacitor value for ESD7551N2T5G is 1nF to 10nF. The capacitor value should be chosen based on the specific application requirements, such as the frequency of operation and the desired level of ESD protection.
  • The maximum operating temperature for ESD7551N2T5G is 125°C. However, it's recommended to operate the device within the specified temperature range of -40°C to 85°C for optimal performance and reliability.
  • Yes, ESD7551N2T5G is suitable for HDMI applications. It meets the HDMI 2.0 specification for ESD protection and can be used to protect HDMI ports from electrostatic discharge.
  • To ensure proper soldering of ESD7551N2T5G, follow the recommended soldering profile and use a soldering iron with a temperature of 260°C to 280°C. Apply a small amount of solder paste to the PCB pads and place the device carefully to avoid bridging or shorting.

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ESD7551N2T5G Overview

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