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ESD7571N2T5G - onsemi

Description: Industry Leading Capacitance Linearity Over Voltage; Ultra−Low Capacitance: 0.35 pF Max; Stand−off Voltage: 5.3 V; Low Leakage: < 1 nA; Low Dynamic Resistance: < 1 Ω; IEC61000−4−2 Level 4 ESD Protection; 1000 ESD IEC61000−4−2 Strikes ±8 kV Contact / Air Discharged; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant; SZESD7571MXWT5G Wettable Flank Pa

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PCB Footprints
ESD7571N2T5G - onsemi PCB footprint - Other - Other - X2DFN2 1.0x0.6, 0.65P CASE 714AB ISSUE B_2023
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3D Models
ESD7571N2T5G - onsemi  - 3D model - Other - X2DFN2 1.0x0.6, 0.65P CASE 714AB ISSUE B_2023
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ESD7571N2T5G Details

  • Manufacturer Part Number:

    ESD7571N2T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    X2DFN-2

  • Manufacturer Package Code:

    714AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Min:

    7 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    5.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD7571N2T5G Frequently Asked Questions (FAQs)

  • A good PCB layout for ESD protection involves placing the ESD7571N2T5G close to the connector or interface, using short traces, and minimizing the distance between the device and the protected circuit. A ground plane or shield should also be used to reduce noise and radiation.
  • To choose the correct ESD protection device, consider the interface or connector type, the voltage and current requirements, and the level of protection needed (e.g., IEC 61000-4-2). The ESD7571N2T5G is suitable for high-speed interfaces like USB, HDMI, and DisplayPort.
  • The ESD7571N2T5G has an operating temperature range of -40°C to 125°C, making it suitable for a wide range of applications, including industrial, automotive, and consumer electronics.
  • The ESD7571N2T5G is designed to absorb and dissipate surge pulses and ESD events, protecting the downstream circuitry from damage. It can withstand up to 15 kV of ESD and 3.3 kV of surge pulses.
  • Yes, the ESD7571N2T5G can be used in a redundant or parallel configuration to provide added protection and increased reliability. However, this should be carefully evaluated to ensure that the overall system performance and power consumption are not compromised.

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ESD7571N2T5G Overview

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