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ESD8101FCT5G - onsemi

Description: These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant; Low Capacitance (0.20 pF Typ, I/O to GND); Protection for the Following IEC Standards: IEC 61000−4−2 (Level 4); Low ESD Clamping Voltage

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PCB Footprints
ESD8101FCT5G - onsemi PCB footprint - Other - Other - ESD8101FCT5G-2
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ESD8101FCT5G - onsemi  - 3D model - Other - ESD8101FCT5G-2
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ESD8101FCT5G Details

  • Manufacturer Part Number:

    ESD8101FCT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DSN-2

  • Manufacturer Package Code:

    152AK

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Max:

    8.6 V

  • Breakdown Voltage-Min:

    5.5 V

  • Breakdown Voltage-Nom:

    7.9 V

  • Clamping Voltage-Max:

    10 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD8101FCT5G Frequently Asked Questions (FAQs)

  • A good PCB layout for ESD8101FCT5G involves placing the device close to the connector or interface, using short traces, and minimizing the distance between the device and the protected line. A ground plane under the device is also recommended.
  • To choose the correct ESD protection device, consider the interface type (e.g., USB, HDMI, Ethernet), the voltage and current requirements, and the level of ESD protection needed (e.g., IEC 61000-4-2). Consult the onsemi selection guide or contact their support team for assistance.
  • The ESD8101FCT5G is rated for operation from -40°C to 125°C, making it suitable for a wide range of applications, including industrial and automotive systems.
  • Yes, the ESD8101FCT5G is suitable for high-speed interfaces like USB 3.0 or HDMI, as it has a low capacitance of 0.4 pF and a low clamping voltage of 6.5 V, ensuring minimal signal distortion and attenuation.
  • Follow the recommended soldering profile and PCB layout guidelines provided in the datasheet. Ensure the device is properly aligned and secured to the PCB, and that the solder joints are clean and free of defects.

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ESD8101FCT5G Overview

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