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ESD8504GMUTAG - onsemi

Description: Low Capacitance (0.5 pF Max, I/O to GND); Protection for the Following IEC Standards: IEC 61000−4−2 (Level 4); Low ESD Clamping Voltage; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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Symbol
ESD8504GMUTAG - onsemi - PCB symbol
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PCB Footprints
ESD8504GMUTAG - onsemi PCB footprint - Other - Other - ESD8504GMUTAG-2
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ESD8504GMUTAG - onsemi - 3D model - Other - ESD8504GMUTAG-2
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ESD8504GMUTAG Details

  • Manufacturer Part Number:

    ESD8504GMUTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    UDFN-10

  • Package Description:

    UDFN10, 10 PIN

  • Manufacturer Package Code:

    517BB

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Max:

    6 V

  • Breakdown Voltage-Min:

    4 V

  • Breakdown Voltage-Nom:

    4.5 V

  • Case Connection:

    ANODE

  • Clamping Voltage-Max:

    8.5 V

  • Configuration:

    COMMON ANODE, 4 ELEMENTS, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-N10

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD8504GMUTAG Frequently Asked Questions (FAQs)

  • A good PCB layout for ESD8504GMUTAG involves keeping the device close to the protected line, using short traces, and minimizing the distance between the device and the connector. A ground plane under the device is also recommended to reduce noise and improve performance.
  • The recommended capacitor value for ESD8504GMUTAG is 1nF to 10nF. The optimal value depends on the specific application, signal frequency, and desired level of protection. A larger capacitor value provides better filtering but may affect signal integrity.
  • The maximum operating temperature for ESD8504GMUTAG is 125°C. However, it's recommended to operate the device within a temperature range of -40°C to 85°C for optimal performance and reliability.
  • Yes, ESD8504GMUTAG is suitable for high-speed data lines up to 10 Gbps. However, it's essential to follow proper PCB layout and design guidelines to minimize signal degradation and ensure optimal performance.
  • To ensure proper soldering, follow the recommended reflow soldering profile, and use a solder paste with a melting point between 217°C to 220°C. Avoid overheating the device, and ensure the PCB is clean and free of contaminants.

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ESD8504GMUTAG Overview

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