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ESD8551N2T5G - onsemi

Description: Low Capacitance (0.30 pF Max, I/O to GND); Protection for the Following IEC Standards: IEC 61000−4−2 (Level 4) ISO10605 330 pF / 2 k? ±30 kV Contact; Low ESD Clamping Voltage; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant; SZESD8551MXWT5G Wettable Flank Package

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ESD8551N2T5G - onsemi PCB footprint - Other - Other - ESD8551N2T5G-1
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ESD8551N2T5G Details

  • Manufacturer Part Number:

    ESD8551N2T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X2DFN-2

  • Package Description:

    X2DFN-2

  • Manufacturer Package Code:

    714AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.79

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Max:

    8.3 V

  • Breakdown Voltage-Min:

    5.5 V

  • Breakdown Voltage-Nom:

    6.9 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD8551N2T5G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal ESD protection involves placing the ESD8551N2T5G close to the connector or interface, using short traces, and minimizing the distance between the device and the protected circuit. Additionally, a solid ground plane and a low-impedance path to ground are essential.
  • To choose the correct ESD protection device, consider the interface or connector type, the voltage and current requirements, and the level of ESD protection needed. The ESD8551N2T5G is suitable for USB interfaces and provides 2kV of ESD protection.
  • The ESD8551N2T5G has an operating temperature range of -40°C to 85°C, making it suitable for most commercial and industrial applications.
  • While the ESD8551N2T5G is optimized for USB interfaces, it can be used for ESD protection in other interfaces such as HDMI, Ethernet, and audio interfaces, as long as the voltage and current requirements are met.
  • The ESD8551N2T5G is designed to withstand multiple ESD strikes without degradation, ensuring continued protection of the downstream circuitry.

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ESD8551N2T5G Overview

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Part Image SZESD8551N2T5G onsemi

Trans Voltage Suppressor Diode, 3.3V V(RWM), Bidirectional, 1 Element, Silicon