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ESD9X12ST5G - onsemi

Description: Low Leakage; Response Time is Typically < 1 ns; ESD Rating of Class 3 (> 16 kV) per Human Body Model; IEC6100042 Level 4 ESD Protection; These are PbFree Devices; Small Body Outline Dimensions: 0.039 x 0.024 (1.0 mm x 0.60 mm); Low Body Height: 0.017 (0.43 mm) Max; Standoff Voltage: 3.3 V 12 V

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PCB Footprints
ESD9X12ST5G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD−923*
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3D Models
ESD9X12ST5G - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD−923*
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ESD9X12ST5G Details

  • Manufacturer Part Number:

    ESD9X12ST5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-923, 1.0x0.6, 0.43 Max Height

  • Package Description:

    SOD-923, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    514AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, PRSM-NOM

  • Breakdown Voltage-Min:

    13.5 V

  • Clamping Voltage-Max:

    23.7 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    140 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.15 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    12 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD9X12ST5G Frequently Asked Questions (FAQs)

  • A good PCB layout for the ESD9X12ST5G involves keeping the device close to the protected line, using short traces, and minimizing the distance between the device and the connector. A ground plane under the device can also help to reduce noise and improve performance.
  • The recommended capacitor value for the ESD9X12ST5G is 1-10nF. The capacitor value should be chosen based on the specific application requirements, such as the frequency of operation and the desired level of ESD protection.
  • The ESD9X12ST5G has an operating temperature range of -40°C to 150°C. However, the device can be operated at temperatures above 150°C for short periods of time, but this may affect its reliability and lifespan.
  • Yes, the ESD9X12ST5G is suitable for high-speed data lines, such as USB, HDMI, and Ethernet. It has a low capacitance of 0.5pF and a high bandwidth of 3GHz, making it suitable for high-speed applications.
  • To ensure proper soldering of the ESD9X12ST5G, use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the device.

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