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ESDA14V2-2BF3 - STMicroelectronics

Description: STMICROELECTRONICS - ESDA14V2-2BF3 - ESD PROTECTION DEVICE, 14.2V, SMD

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ESDA14V2-2BF3 - STMicroelectronics PCB footprint - BGA - BGA - BGA-4
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ESDA14V2-2BF3 - STMicroelectronics  - 3D model - BGA - BGA-4
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ESDA14V2-2BF3 Details

  • Manufacturer Part Number:

    ESDA14V2-2BF3

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FLIP-CHIP

  • Package Description:

    ROHS COMPLIANT, FLIP CHIP-4

  • Pin Count:

    4

  • Country Of Origin:

    France

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Breakdown Voltage-Max:

    18 V

  • Breakdown Voltage-Min:

    14.2 V

  • Breakdown Voltage-Nom:

    16.1 V

  • Configuration:

    COMPLEX, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e1

  • Non-rep Peak Rev Power Dis-Max:

    50 W

  • Number of Elements:

    3

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2; MIL-STD-883E

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    12 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESDA14V2-2BF3 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal ESD protection involves placing the ESDA14V2-2BF3 close to the connector or interface, using short traces, and minimizing the distance between the device and the protected line. Additionally, a ground plane and a solid ground connection are essential for effective ESD protection.
  • To choose the correct ESD protection device, consider the interface or standard being protected (e.g., USB, HDMI, Ethernet), the voltage and current requirements, and the level of ESD protection required (e.g., 2kV, 4kV, 8kV). The ESDA14V2-2BF3 is suitable for general-purpose ESD protection in various applications.
  • The ESDA14V2-2BF3 is a bidirectional ESD protection device with a low capacitance of 0.4pF, making it suitable for high-speed interfaces. It also has a low clamping voltage of 6V, which helps to protect sensitive components. Other ESD protection devices from STMicroelectronics may have different capacitance values, clamping voltages, or package options.
  • To ensure proper soldering and connection, follow the recommended soldering profile, use a solder with a melting point below 260°C, and avoid overheating the device. Also, ensure the device is properly aligned with the PCB pads and that the solder joints are clean and free of oxidation.
  • The ESDA14V2-2BF3 is manufactured by STMicroelectronics, a reputable semiconductor company, and meets various industry standards for reliability and quality, including AEC-Q101 and IEC 61000-4-2. The device is also RoHS and REACH compliant.

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ESDA14V2-2BF3 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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