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ESDLC12VD3B-TP - MCC

Description: ESD Protection Devices

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PCB Footprints
ESDLC12VD3B-TP - MCC PCB footprint - Small Outline Diode - Small Outline Diode - SOD-323 (Thickness 1.15mm)
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3D Models
ESDLC12VD3B-TP - MCC  - 3D model - Small Outline Diode - SOD-323 (Thickness 1.15mm)
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ESDLC12VD3B-TP Details

  • Manufacturer Part Number:

    ESDLC12VD3B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.38

  • Breakdown Voltage-Min:

    13.3 V

  • Clamping Voltage-Max:

    28.6 V

  • Configuration:

    COMMON BIPOLAR TERMINAL, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    350 W

  • Number of Elements:

    2

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    1 µA

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

ESDLC12VD3B-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for ESDLC12VD3B-TP is a rectangular pad with dimensions of 1.3mm x 0.8mm, with a 0.5mm diameter hole in the center for the device's lead.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes the risk of overheating the device.
  • The maximum allowable voltage for ESDLC12VD3B-TP is 12V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • ESDLC12VD3B-TP is rated for operation up to 125°C. However, it's recommended to derate the device's performance at high temperatures to ensure reliable operation.
  • Handle ESDLC12VD3B-TP by the body or the lead frame, avoiding direct contact with the die. Use an anti-static wrist strap or mat to prevent ESD damage during handling and assembly.

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ESDLC12VD3B-TP Overview

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