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ESDM2032MX4T5G - onsemi

Description: These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS; Stand-off Voltage: 3.3 V; Small Body Outline Dimensions: 0.60 mm x 0.30 mm, 0.20 mm thickness; >15 A Peak Pulse Current Capable, 8x20 us Surge; Ultra-Low RDYN; FC > 350 MHz

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PCB Footprints
ESDM2032MX4T5G - onsemi PCB footprint - Other - Other - X4DFN2, 0.60x0.30, 0.36P CASE 152AX ISSUE G
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3D Models
ESDM2032MX4T5G - onsemi  - 3D model - Other - X4DFN2, 0.60x0.30, 0.36P CASE 152AX ISSUE G
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ESDM2032MX4T5G Details

  • Manufacturer Part Number:

    ESDM2032MX4T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-2

  • Package Description:

    X4DFN2, 2 PIN

  • Manufacturer Package Code:

    152AX

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE

  • Breakdown Voltage-Max:

    6.7 V

  • Breakdown Voltage-Min:

    3.7 V

  • Breakdown Voltage-Nom:

    5.2 V

  • Clamping Voltage-Max:

    8.2 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.313 W

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESDM2032MX4T5G Frequently Asked Questions (FAQs)

  • A good PCB layout for the ESDM2032MX4T5G involves keeping the device as close as possible to the protected line, using short traces, and minimizing the distance between the device and the connector. Additionally, a ground plane underneath the device can help to reduce noise and improve performance.
  • The recommended capacitor value for the ESDM2032MX4T5G is 1nF to 10nF. The optimal value depends on the specific application and the desired level of ESD protection. A larger capacitor value can provide better ESD protection but may affect the signal integrity.
  • The ESDM2032MX4T5G is rated for operation from -40°C to 125°C. However, the device can be used in applications with a maximum operating temperature of 150°C, but with reduced reliability and performance.
  • Yes, the ESDM2032MX4T5G is designed to protect high-speed data lines up to 10 Gbps. However, the device's performance may be affected by the signal frequency, and additional components may be required to ensure signal integrity.
  • Yes, the ESDM2032MX4T5G is AEC-Q101 qualified, making it suitable for use in automotive applications. However, it's essential to ensure that the device meets the specific requirements of the application, including temperature range, voltage, and ESD protection.

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ESDM2032MX4T5G Overview

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