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ESDR0502BT1G - onsemi

Description: Low Capacitance 0.5 pF Typical; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; Low Clamping Voltage; Stand−off Voltage: 5 V; Small Body Outline Dimensions: 0.063” x 0.063” (1.60 mm x 1.60 mm); Response Time is Typically < 1.0 ns; IEC61000−4−2 Level 4 ESD Protection ISO10605 330 pF/2 k ±17 kV (Contact); This is a Pb−Free Device

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PCB Footprints
ESDR0502BT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC−75/SOT−416_2023
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ESDR0502BT1G - onsemi  - 3D model - SOT23 (3-Pin) - SC−75/SOT−416_2023
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ESDR0502BT1G Details

  • Manufacturer Part Number:

    ESDR0502BT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-75 (SOT-416) 3 LEAD

  • Package Description:

    SC-75, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    463-01

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.44

  • Additional Feature:

    ULTRA LOW CAPACITANCE

  • Breakdown Voltage-Min:

    5.8 V

  • Clamping Voltage-Max:

    15 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    S-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    20 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.15 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ESDR0502BT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for ESDR0502BT1G involves keeping the device close to the protected line, using short traces, and minimizing the distance between the device and the connector. A ground plane under the device can also help reduce noise and improve performance.
  • The recommended capacitor value for ESDR0502BT1G is 1-10nF. The capacitor value should be chosen based on the specific application requirements, such as the frequency of operation and the desired level of ESD protection.
  • The maximum operating temperature for ESDR0502BT1G is 125°C. However, it's recommended to operate the device within the specified temperature range of -40°C to 85°C for optimal performance and reliability.
  • Yes, ESDR0502BT1G is suitable for high-speed data lines, such as USB, HDMI, and Ethernet. The device is designed to provide ESD protection while minimizing signal distortion and attenuation.
  • To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point below 260°C. Apply a small amount of solder paste to the PCB pads and use a reflow oven or a hot air gun to solder the device.

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