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ESR01MZPJ241 - ROHM Semiconductor

Description: Thick Film Resistors - SMD 0402 240ohm 5% Anti Surge AEC-Q200

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PCB Footprints
ESR01MZPJ241 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - ESR01
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ESR01MZPJ241 - ROHM Semiconductor  - 3D model - Resistor Chip - ESR01
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ESR01MZPJ241 Details

  • Manufacturer Part Number:

    ESR01MZPJ241

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Additional Feature:

    LASER TRIMMABLE

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.35 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.2 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    0.00024 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    50 V

ESR01MZPJ241 Frequently Asked Questions (FAQs)

  • The recommended land pattern for ESR01MZPJ241 can be found in the ROHM Semiconductor's packaging specification document, which is usually available on their website. The document provides detailed information on the recommended pad layout, solder mask, and solder fillet dimensions for reliable assembly and soldering.
  • To prevent damage, it is recommended to store ESR01MZPJ241 in a dry, cool place away from direct sunlight and moisture. During shipping, the components should be packaged in anti-static bags or tubes to prevent electrostatic discharge (ESD) damage. It is also recommended to follow the ESD handling procedures outlined in the JEDEC standard JESD625-A.
  • The thermal resistance of the ESR01MZPJ241 package is not explicitly stated in the datasheet. However, ROHM Semiconductor provides a thermal resistance model for their chip resistors, which can be used to estimate the thermal resistance of the ESR01MZPJ241. The thermal resistance model is usually available in the ROHM Semiconductor's application notes or technical support website.
  • The ESR01MZPJ241 is a general-purpose chip resistor and is not specifically designed for high-frequency applications. While it may work in some high-frequency circuits, its performance may not be optimal due to its internal construction and materials. For high-frequency applications, it is recommended to use chip resistors specifically designed for high-frequency use, such as those with a high-frequency compatible termination or a specialized high-frequency resistor series.
  • The power rating of the ESR01MZPJ241 is specified in the datasheet as 1/4W. However, the actual power rating in a specific application depends on the operating conditions, such as the ambient temperature, airflow, and PCB layout. To determine the power rating, you need to calculate the power dissipation of the resistor using the formula P = V^2/R, where V is the voltage across the resistor and R is the resistance value. Then, you need to derate the power rating based on the operating conditions using the derating curve provided in the datasheet.

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ESR01MZPJ241 Overview

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