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ESR03EZPF1502 - ROHM Semiconductor

Description: 15kΩ 0603 Thick Film Anti-surge Resistor ±1% 0.25W ESR03EZPF1502

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ESR03EZPF1502 - ROHM Semiconductor - PCB symbol
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ESR03EZPF1502 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - ESR03
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ESR03EZPF1502 - ROHM Semiconductor - 3D model - Resistor Chip - ESR03
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ESR03EZPF1502 Details

  • Manufacturer Part Number:

    ESR03EZPF1502

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    10

  • Additional Feature:

    LASER TRIMMABLE

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.33 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    15000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

ESR03EZPF1502 Frequently Asked Questions (FAQs)

  • The recommended land pattern for ESR03EZPF1502 is a rectangular pad with a size of 1.5mm x 0.8mm, with a solder mask opening of 1.2mm x 0.5mm. The land pattern should be designed to accommodate the component's dimensions and thermal considerations.
  • To handle thermal considerations for ESR03EZPF1502, ensure that the component is mounted on a thermally conductive material, such as a copper plane or a thermal pad. Also, ensure that the component is not exposed to excessive temperatures during soldering or operation.
  • The recommended soldering temperature profile for ESR03EZPF1502 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, ESR03EZPF1502 is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage or detachment.
  • To ensure the reliability of ESR03EZPF1502 in a humid environment, apply a conformal coating to the component and the surrounding PCB area. This will help prevent moisture ingress and corrosion.

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ESR03EZPF1502 Overview

Use the download button to access the ESR03EZPF1502 schematic symbol, PCB footprint, and 3D model.
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ESR03EZPF1502 Alternates

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Part Image RPCH16K1502FB Kamaya Inc

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Part Image SG73S1JTTD153F KOA Speer Electronics Inc

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Part Image NRCPH06F1502TRQYF NIC Components Corp

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