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ESR03EZPF2000 - ROHM Semiconductor

Description: ROHM - ESR03EZPF2000 - SMD Chip Resistor, Anti-Surge, 0603 [1608 Metric], 200 ohm, ESR Series, 150 V, Thick Film, 250 mW

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ESR03EZPF2000 - ROHM Semiconductor - PCB symbol
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ESR03EZPF2000 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - ESR03
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ESR03EZPF2000 - ROHM Semiconductor - 3D model - Resistor Chip - ESR03
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ESR03EZPF2000 Details

  • Manufacturer Part Number:

    ESR03EZPF2000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Additional Feature:

    LASER TRIMMABLE

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.33 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    0.0002 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

ESR03EZPF2000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for ESR03EZPF2000 is a rectangular pad with a size of 1.5mm x 0.8mm, with a solder mask opening of 1.2mm x 0.5mm. The land pattern should be designed to accommodate the component's dimensions and thermal considerations.
  • To ensure proper thermal management, it is recommended to provide a thermal pad on the PCB, connected to a large copper area or a heat sink. The thermal pad should be designed to dissipate heat efficiently, and the component should be placed in a way that allows for good airflow.
  • The maximum operating temperature range for ESR03EZPF2000 is -40°C to 125°C. However, it is recommended to operate the component within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • To ensure the reliability of ESR03EZPF2000 in high-humidity environments, it is recommended to apply a conformal coating to the PCB, and to use a moisture-resistant packaging material. Additionally, the component should be stored in a dry environment, and the PCB should be designed to minimize moisture absorption.
  • The recommended soldering profile for ESR03EZPF2000 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be designed to minimize thermal shock and ensure good wetting of the solder.

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ESR03EZPF2000 Overview

Use the download button to access the ESR03EZPF2000 schematic symbol, PCB footprint, and 3D model.
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Part Image RPGW16K2000FB Kamaya Inc

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For a full list of alternate parts for ESR03EZPF2000, check out Findchips.com