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ESR03EZPJ330 - ROHM Semiconductor

Description: ROHM - ESR03EZPJ330 - SMD Chip Resistor, Anti-Surge, 0603 [1608 Metric], 33 ohm, ESR Series, 150 V, Thick Film, 250 mW

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ESR03EZPJ330 - ROHM Semiconductor - PCB symbol
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PCB Footprints
ESR03EZPJ330 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - ESR03
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ESR03EZPJ330 - ROHM Semiconductor - 3D model - Resistor Chip - ESR03
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ESR03EZPJ330 Details

  • Manufacturer Part Number:

    ESR03EZPJ330

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Additional Feature:

    LASER TRIMMABLE

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.33 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    0.000033 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    150 V

ESR03EZPJ330 Frequently Asked Questions (FAQs)

  • The recommended land pattern for ESR03EZPJ330 is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask opening of 2.2mm x 0.9mm.
  • To handle thermal considerations, ensure a good thermal connection to a heat sink or a thermal pad, and consider using thermal interface material to reduce thermal resistance. Also, follow the recommended PCB layout guidelines to minimize thermal impedance.
  • The maximum operating temperature range for ESR03EZPJ330 is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
  • To ensure reliability in high-humidity environments, follow the recommended moisture sensitivity level (MSL) handling and storage guidelines, and consider using a moisture barrier coating or conformal coating on the PCB.
  • The recommended soldering conditions for ESR03EZPJ330 are a peak temperature of 260°C, with a soldering time of 10 seconds or less, and a soldering iron temperature of 350°C or less.

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ESR03EZPJ330 Overview

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