ESR10EZPJ101 footprint, schematic symbol and 3D model by ROHM Semiconductor

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ESR10EZPJ101 Details

The recommended land pattern for ESR10EZPJ101 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
To handle thermal considerations, ensure good thermal conductivity between the component and the PCB by using a thermal via or a thermal pad. Also, consider using a heat sink or a thermal interface material to reduce thermal resistance.
The maximum operating temperature range for ESR10EZPJ101 is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
To ensure reliability in high-vibration environments, use a secure mounting method, such as a screw or adhesive, and consider using a vibration-dampening material or a shock-absorbing mount.
ESR10EZPJ101 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and storage to prevent damage.

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