ESR10EZPJ472 footprint, schematic symbol and 3D model by ROHM Semiconductor

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ESR10EZPJ472 Details

The recommended land pattern for ESR10EZPJ472 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
To handle thermal considerations, ensure good thermal conductivity between the component and the PCB by using a thermal via or a thermal pad, and consider using a heat sink or a thermal interface material if necessary.
The maximum operating temperature range for ESR10EZPJ472 is -55°C to +125°C, but it's recommended to operate within -40°C to +85°C for optimal performance and reliability.
Yes, ESR10EZPJ472 is suitable for high-frequency applications up to 100 MHz, but it's essential to consider the component's self-resonant frequency and the PCB's layout to minimize parasitic effects.
To ensure reliability in a humid environment, apply a conformal coating to the PCB, use a moisture-resistant packaging, and consider using a humidity sensor to monitor the environment.

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