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ESR25JZPJ100 - ROHM Semiconductor

Description: ROHM - ESR25JZPJ100 - SMD Chip Resistor, Anti-Surge, 1210 [3225 Metric], 10 ohm, ESR Series, 200 V, Thick Film, 660 mW

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ESR25JZPJ100 - ROHM Semiconductor - PCB symbol
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ESR25JZPJ100 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - 3225
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ESR25JZPJ100 - ROHM Semiconductor - 3D model - Resistor Chip - 3225
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ESR25JZPJ100 Details

  • Manufacturer Part Number:

    ESR25JZPJ100

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Additional Feature:

    LASER TRIMMABLE

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    0.00001 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

ESR25JZPJ100 Frequently Asked Questions (FAQs)

  • The recommended land pattern for ESR25JZPJ100 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conductivity between the component and the PCB by using a thermal via or a thermal pad. Also, consider using a heat sink or a thermal interface material (TIM) to improve heat dissipation.
  • The maximum operating temperature range for ESR25JZPJ100 is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
  • To ensure reliability in high-vibration environments, use a secure mounting method, such as soldering or adhesive bonding, and consider using a vibration-dampening material or a shock-absorbing mount.
  • To protect ESR25JZPJ100 from electrostatic discharge (ESD), use ESD-sensitive handling procedures, and consider using ESD protection devices, such as TVS diodes or ESD arrays, in the circuit design.

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ESR25JZPJ100 Overview

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ESR25JZPJ100 Alternates

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Part Image PWR13JTFT0100NA Viking Tech Corp

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Part Image SG73P2E1ATBK100J KOA Speer Electronics Inc

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