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ESR25JZPJ512 - ROHM Semiconductor

Description: Thick Film Resistors - SMD 1210 5K1ohm 5% Anti Surge AEC-Q200

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ESR25JZPJ512 - ROHM Semiconductor - PCB symbol
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PCB Footprints
ESR25JZPJ512 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - ESR25 / 1210
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3D Models
ESR25JZPJ512 - ROHM Semiconductor - 3D model - Resistor Chip - ESR25 / 1210
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ESR25JZPJ512 Details

  • Manufacturer Part Number:

    ESR25JZPJ512

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Additional Feature:

    LASER TRIMMABLE

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    0.0051 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

ESR25JZPJ512 Frequently Asked Questions (FAQs)

  • The recommended land pattern for ESR25JZPJ512 can be found in ROHM's application note AP144, which provides guidelines for PCB design and layout.
  • ROHM recommends following the thermal design guidelines outlined in the datasheet, including using a thermal pad and ensuring good thermal conductivity between the device and the PCB. Additionally, thermal simulation tools can be used to optimize the design.
  • The maximum operating temperature range for ESR25JZPJ512 is -40°C to 125°C, as specified in the datasheet. However, it's recommended to derate the device's performance at higher temperatures to ensure reliability.
  • Yes, ESR25JZPJ512 is designed to withstand vibrations up to 10G, as specified in the datasheet. However, it's recommended to follow ROHM's guidelines for vibration testing and to ensure proper PCB design and assembly to minimize the risk of mechanical stress.
  • ROHM recommends following the moisture sensitivity level (MSL) guidelines for ESR25JZPJ512, which is MSL3. This means that the device should be stored in a dry environment and handled according to ROHM's guidelines to prevent moisture-related failures.

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ESR25JZPJ512 Overview

Use the download button to access the ESR25JZPJ512 schematic symbol, PCB footprint, and 3D model.
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