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ETCE330M9GB - Panasonic

Description: 330µF Molded Tantalum Polymer Capacitor 2.5V 1411 (3528 Metric) 9mOhm @ 300kHz

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ETCE330M9GB - Panasonic PCB footprint - Capacitor Moulded Polarised - Capacitor Moulded Polarised - B2
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ETCE330M9GB - Panasonic  - 3D model - Capacitor Moulded Polarised - B2
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ETCE330M9GB Details

  • Manufacturer Part Number:

    ETCE330M9GB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Indonesia, Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    7

  • Additional Feature:

    ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ

  • Capacitance:

    330 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (SOLID POLYMER)

  • ESR:

    9 mΩ

  • Height:

    1.9 mm

  • Leakage Current:

    0.165 mA

  • Length:

    3.5 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Style:

    SMT

  • Packing Method:

    TR, 7 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    2.5 V

  • Ripple Current:

    3200 mA

  • Size Code:

    1411

  • Surface Mount:

    YES

  • Tan Delta:

    0.08

  • Terminal Shape:

    J BEND

  • Width:

    2.8 mm

ETCE330M9GB Frequently Asked Questions (FAQs)

  • Panasonic provides a recommended PCB layout and land pattern in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, minimize thermal resistance, and prevent electrical noise.
  • Proper thermal management is crucial for the reliability and lifespan of the component. Ensure good airflow, use thermal vias, and consider heat sinks or thermal interface materials to keep the junction temperature below the recommended 125°C.
  • Handle the component with care, using anti-static wrist straps, mats, and bags. Follow standard ESD protection procedures, such as grounding and ionization, to prevent damage during assembly and storage.
  • While the component is designed to withstand some vibration and shock, it's essential to evaluate the specific environmental conditions and ensure the component is properly secured and supported to prevent mechanical stress and damage.
  • Consult Panasonic's troubleshooting guides and application notes for common issues and solutions. Perform thorough testing, including thermal imaging and electrical characterization, to identify the root cause of the problem.

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ETCE330M9GB Overview

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