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ETLE330MCGB - Panasonic

Description: Series/Type: TLE, Rated Voltage (V): 2.5, Capacitance (µF): 330, Tolerance on Capacitance (%): +/-20, Category Temperature Range (°C): -55 to +125, Endurance@Temp: 2000h@125°C, Rated Ripple Current (mArms): 2770, Rated Ripple Current (temp.) (°C): 45, Rated Ripple Current (freq.) (kHz): 100, ESR (mΩ): 12, ESR Frequency (kHz): 300, Leakage Current [Max.] (µA): 165, Dissipation Factor [Max.]: 0.08, Body Length (mm): 3.5, Body Width (mm): 2.8, Body Height (mm): 1.9, Size Code: B2

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PCB Footprints
ETLE330MCGB - Panasonic PCB footprint - Other - Other - B2
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ETLE330MCGB - Panasonic  - 3D model - Other - B2
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ETLE330MCGB Details

  • Manufacturer Part Number:

    ETLE330MCGB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    0

  • Additional Feature:

    ESR IS MEASURED AT 300 KHZ, RIPPLE CURRENT IS MEASURED AT 100 KHZ AND 45CEL

  • Capacitance:

    330 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (SOLID POLYMER)

  • ESR:

    12 mΩ

  • Height:

    1.9 mm

  • Leakage Current:

    0.165 mA

  • Length:

    3.5 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    2.5 V

  • Ripple Current:

    2770 mA

  • Size Code:

    1411

  • Surface Mount:

    YES

  • Tan Delta:

    0.08

  • Terminal Shape:

    J BEND

  • Width:

    2.8 mm

ETLE330MCGB Frequently Asked Questions (FAQs)

  • Panasonic provides a recommended PCB layout and land pattern in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, minimize thermal resistance, and prevent electrical noise.
  • Proper thermal management is crucial for the ETLE330MCGB. Ensure good airflow, use a heat sink if necessary, and follow Panasonic's thermal design guidelines. The device's thermal resistance (Rth) is specified in the datasheet, and it's essential to keep the junction temperature (Tj) below the maximum rating.
  • The ETLE330MCGB is sensitive to electrostatic discharge (ESD). Handle the device with ESD-protective equipment, such as wrist straps, mats, and bags. Follow Panasonic's ESD handling guidelines and ensure that your production line and storage facilities are ESD-safe.
  • While the ETLE330MCGB is a robust component, it's essential to evaluate its suitability for high-vibration or high-shock environments. Panasonic provides guidelines for vibration and shock testing, and you should consult with their application engineers to determine the device's feasibility in your specific application.
  • To ensure the reliability and longevity of the ETLE330MCGB, follow Panasonic's recommended operating conditions, derating guidelines, and storage instructions. Implement proper power sequencing, voltage regulation, and decoupling to minimize electrical stress. Regularly inspect and maintain your equipment to prevent damage and wear.

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ETLE330MCGB Overview

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Part Image PSHB20E337M025BLL KEMET Corporation

Tantalum Capacitor, Polarized, Tantalum (solid Polymer), 2.5V, 20% +Tol, 20% -Tol, 330uF, Surface Mount, 1411