Inventronics recommends a multi-layer PCB with a large copper area for heat dissipation, and a thermal pad on the bottom of the module for heat sinking. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of 1-2 W/m-K is recommended between the module and the heat sink.
Inventronics recommends ensuring good airflow within the enclosure, using a heat sink with a high thermal conductivity, and applying a thermal interface material (TIM) between the module and the heat sink. Additionally, the enclosure should be designed to allow for convection cooling, and the module should be mounted in a way that allows for maximum airflow around it.
Inventronics recommends derating the input voltage by 10-15% to ensure reliable operation and to account for voltage tolerances. For example, if the module is rated for 100-150VDC input, the maximum allowable voltage derating would be 135VDC (150VDC - 15% of 150VDC).
Inventronics recommends checking the input voltage, output load, and ambient temperature to ensure they are within the specified ranges. Additionally, checking the output voltage ripple, noise, and transient response can help identify issues. If the problem persists, contact Inventronics' technical support for further assistance.
Inventronics recommends using a fuse with a rating of 5-10A, depending on the input voltage and current requirements. A slow-blow fuse (e.g. Littlefuse 5A or 10A) is recommended to ensure that the module is protected from input voltage surges and transients.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
EUM-200S105DG Overview
Use the download button to access the EUM-200S105DG 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like EUM-2,
or try a keyword search, such as Power Supply Modules
