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F339X133348MFP2B0 - Vishay

Description: 0.033 µF Film Capacitor 480V 1000V (1kV) Polypropylene (PP), Metallized Radial

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F339X133348MFP2B0 - Vishay - PCB symbol
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F339X133348MFP2B0 - Vishay PCB footprint - Other - Other - F339X133348MFP2B0-1
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F339X133348MFP2B0 - Vishay - 3D model - Other - F339X133348MFP2B0-1
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F339X133348MFP2B0 Details

  • Manufacturer Part Number:

    F339X133348MFP2B0

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.25.00.70

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.24

  • Additional Feature:

    SAFETY CLASS X1

  • Capacitance:

    0.033 µF

  • Capacitor Type:

    FILM CAPACITOR

  • Dielectric Material:

    POLYPROPYLENE

  • Height:

    11 mm

  • JESD-609 Code:

    e3

  • Length:

    17.5 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    Radial

  • Packing Method:

    BULK

  • Positive Tolerance:

    20%

  • Rated (AC) Voltage (URac):

    480 V

  • Rated (DC) Voltage (URdc):

    1000 V

  • Reference Standard:

    AEC-Q200, CSA, CQC, CUL, IEC60384-14, UL

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Pitch:

    15 mm

  • Terminal Shape:

    WIRE

  • Width:

    5 mm

F339X133348MFP2B0 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for F339X133348MFP2B0 is a rectangular pad with dimensions of 3.3mm x 1.35mm, with a 0.5mm radius corner and a 0.2mm spacing between pads.
  • While the F339X133348MFP2B0 is rated for operation up to 150°C, it's essential to consider the derating curves and thermal management to ensure reliable operation in high-temperature environments.
  • To prevent ESD damage, handle the F339X133348MFP2B0 with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the PCB and assembly process also follow ESD-safe practices.
  • The recommended soldering profile for F339X133348MFP2B0 is a peak temperature of 260°C, with a dwell time of 10-30 seconds, and a ramp rate of 3°C/s. However, it's essential to consult the specific soldering guidelines for your assembly process.
  • While the F339X133348MFP2B0 is not hermetically sealed, it's designed to operate in a normal environment. However, it's crucial to consider the moisture sensitivity level (MSL) and follow proper handling and storage procedures to prevent moisture-related issues.

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F339X133348MFP2B0 Overview

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