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FA26NP02J682JNU06 - TDK

Description: MLCC with Dipped Radial Lead, Capacitance=6.8nF, LxWxT:5.5x6x3.5mm, Lead pitch:5mm

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PCB Footprints
FA26NP02J682JNU06 - TDK PCB footprint - Other - Other - FA26
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3D Models
FA26NP02J682JNU06 - TDK  - 3D model - Other - FA26
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FA26NP02J682JNU06 Details

  • Manufacturer Part Number:

    FA26NP02J682JNU06

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Capacitance:

    0.0068 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    6 mm

  • JESD-609 Code:

    e3

  • Length:

    5.5 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    5%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Style:

    Radial

  • Packing Method:

    AMMO PACK

  • Positive Tolerance:

    5%

  • Rated (DC) Voltage (URdc):

    630 V

  • Reference Standard:

    AEC-Q200

  • Surface Mount:

    NO

  • Temperature Characteristics Code:

    C0G

  • Temperature Coefficient:

    30ppm/Cel ppm/°C

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Pitch:

    5 mm

  • Terminal Shape:

    WIRE

  • Width:

    3.5 mm

FA26NP02J682JNU06 Frequently Asked Questions (FAQs)

  • The recommended land pattern for FA26NP02J682JNU06 can be found in the TDK Corporation's recommended land pattern document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • Thermal management is critical for FA26NP02J682JNU06, especially in high-power applications. TDK recommends using a thermal pad or a heat sink to dissipate heat away from the component. The thermal pad should be connected to a copper plane or a heat sink with a thermal conductivity of at least 1 W/mK. Additionally, ensure that the component is placed in a well-ventilated area to prevent overheating.
  • The maximum operating temperature range for FA26NP02J682JNU06 is typically specified as -40°C to +125°C, but it's essential to check the datasheet or consult with TDK Corporation for specific temperature ratings, as they may vary depending on the application and environmental conditions.
  • To ensure the reliability of FA26NP02J682JNU06 in high-reliability applications, follow TDK's recommended storage and handling procedures, and ensure that the component is soldered correctly. Additionally, perform thorough testing and inspection during the manufacturing process, and consider using redundant components or error correction mechanisms to mitigate potential failures.
  • FA26NP02J682JNU06 is designed to withstand moderate vibration levels, but it's essential to check the datasheet or consult with TDK Corporation for specific vibration ratings. If the application involves high-vibration environments, consider using additional mechanical support or vibration-dampening materials to ensure the component's reliability.

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FA26NP02J682JNU06 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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