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FA28NP01H103JNU00 - TDK

Description: MLCC with Dipped Radial Lead, Capacitance=10nF, LxWxT:4x5.5x2.5mm, Lead pitch:5mm

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Symbol
FA28NP01H103JNU00 - TDK - PCB symbol
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PCB Footprints
FA28NP01H103JNU00 - TDK PCB footprint - Other - Other - FA28
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3D Models
FA28NP01H103JNU00 - TDK - 3D model - Other - FA28
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FA28NP01H103JNU00 Details

  • Manufacturer Part Number:

    FA28NP01H103JNU00

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    6.68

  • Capacitance:

    0.01 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    5.5 mm

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    5%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Style:

    Radial

  • Packing Method:

    BULK

  • Positive Tolerance:

    5%

  • Rated (DC) Voltage (URdc):

    50 V

  • Reference Standard:

    AEC-Q200

  • Surface Mount:

    NO

  • Temperature Characteristics Code:

    C0G

  • Temperature Coefficient:

    30ppm/Cel ppm/°C

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Pitch:

    5 mm

  • Terminal Shape:

    WIRE

  • Width:

    2.5 mm

FA28NP01H103JNU00 Frequently Asked Questions (FAQs)

  • The recommended land pattern for FA28NP01H103JNU00 can be found in the TDK Corporation's application note or footprint recommendation document, which provides detailed information on the recommended pad layout and dimensions for optimal performance and reliability.
  • Thermal management of FA28NP01H103JNU00 is crucial to ensure reliable operation. It is recommended to provide a thermal pad or heat sink on the PCB to dissipate heat generated by the component. The thermal pad should be connected to a copper plane or a heat sink to effectively dissipate heat.
  • The maximum operating temperature range for FA28NP01H103JNU00 is typically specified as -40°C to +125°C, but it's essential to check the datasheet or consult with TDK Corporation for specific temperature ratings and derating information.
  • FA28NP01H103JNU00 is designed to withstand certain levels of vibration, but it's crucial to evaluate the component's vibration tolerance and ensure that it meets the specific requirements of your application. Consult with TDK Corporation or refer to their reliability and environmental testing data for more information.
  • To ensure the reliability of FA28NP01H103JNU00 in a humid environment, it's recommended to follow proper storage and handling procedures, use moisture-resistant packaging, and consider applying a conformal coating to the PCB. Additionally, ensure that the component is properly soldered and that the PCB is designed with moisture-resistant materials.

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FA28NP01H103JNU00 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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FA28NP01H103JNU00 Alternates

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Part Image FA18NP01H103JNU00 TDK Corporation

Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.01uF, Through Hole Mount