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FAN103MY - onsemi

Description: FAN103MY, PWM Current Mode Controller,

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FAN103MY - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead, Small Outline Package (SOP-8)
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FAN103MY Details

  • Manufacturer Part Number:

    FAN103MY

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    25 V

  • Input Voltage-Min:

    5.5 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    5 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    53 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

FAN103MY Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad connected to a large copper area on the PCB, and ensuring good thermal conductivity between the device and the heat sink. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, including proper heat sinking, thermal interface material selection, and PCB layout. Additionally, the device should be operated within the specified temperature range and derated accordingly.
  • The maximum allowed voltage on the enable pin is 6V, which is the absolute maximum rating. However, it is recommended to keep the enable voltage between 2.4V and 5.5V for reliable operation.
  • Yes, the FAN103MY can be used in high-frequency switching applications up to 1MHz. However, it is essential to consider the device's switching characteristics, including rise and fall times, and ensure that the application meets the device's specifications.
  • To handle the inrush current during startup, it is recommended to use a soft-start circuit or a current-limiting resistor in series with the input voltage. This helps to reduce the inrush current and prevent damage to the device.

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FAN103MY Overview

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