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FAN3216TMX - onsemi

Description: 2.4A Sink / 1.6A Source at VOUT = 6V; Internal Resistors Turn Driver Off If No Inputs; Typical Propagation Delay Under 20ns Matched within 1ns to the Other Channel; MillerDrive™ Technology; 3A Peak Sink/Source at VDD = 12V; Two Versions of Dual Independent Drivers: ; 12ns / 9ns Typical Rise/Fall Times with 1nF Load; Dual Non-Inverting (FAN3217); Dual Inverting (FAN3216); TTL Input Thresholds; Rated from -40°C to +125°C Ambient; 4.5 to 18V Operating Range; Standard SOIC-8 Package; Double Current Capability b

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FAN3216TMX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8 CASE 751EB HEIGHT 1.75_
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FAN3216TMX - onsemi  - 3D model - Small Outline Packages - SOIC8 CASE 751EB HEIGHT 1.75_
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FAN3216TMX Details

  • Manufacturer Part Number:

    FAN3216TMX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    3 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    18 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.034 µs

  • Turn-on Time:

    0.034 µs

  • Width:

    3.9 mm

FAN3216TMX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. It's also recommended to keep the thermal path short and use a thermal pad on the PCB.
  • Ensure that the device is operated within the recommended temperature range (–40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • The FAN3216TMX has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the FAN3216TMX is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q100 and is manufactured using a qualified process. However, additional testing and validation may be required for specific applications.
  • Start by checking the device's pinout and connections. Verify that the input voltage and current are within the recommended range. Use a scope or logic analyzer to monitor the device's output and input signals. Consult the datasheet and application notes for troubleshooting guidelines.

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