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FAN3227TMX - onsemi

Description: Four Versions of Dual Independent Drivers: ; 3A Peak Sink/Source at VDD = 12V ; Dual Inverting + Enable (FAN3226) ; Typical Propagation Delay Under 20ns Matched within 1ns to the Other Channel ; 4.5 to 18V Operating Range ; 8-Lead 3x3mm MLP or 8-Lead SOIC Package ; Dual Non-Inverting + Enable (FAN3227) ; Dual-Inputs in Two Pin-Out Configurations:   ■ Compatible with FAN3225x (FAN3228)   ■ Compatible with TPS2814D (FAN3229) ; MillerDrive™ Technology ; 12ns / 9ns Typical Rise/Fall Times with 1nF Load ; Intern

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FAN3227TMX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 8 lead sop
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FAN3227TMX - onsemi  - 3D model - Small Outline Packages - 8 lead sop
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FAN3227TMX Details

  • Manufacturer Part Number:

    FAN3227TMX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7.15

  • Built-in Protections:

    TRANSIENT

  • High Side Driver:

    NO

  • Input Characteristics:

    GATED SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    3 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.032 µs

  • Turn-on Time:

    0.034 µs

  • Width:

    3.9 mm

FAN3227TMX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FAN3227TMX involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a shielded inductor and to keep the switching node (SW) away from sensitive nodes.
  • The inductor value depends on the input voltage, output voltage, and switching frequency. A good starting point is to use the inductor value recommended in the datasheet (e.g., 1.5 μH). Then, adjust the value based on the specific application requirements, such as output current and ripple requirements.
  • The maximum ambient temperature for the FAN3227TMX is 85°C. However, the device can operate up to 125°C junction temperature. It's essential to ensure proper thermal management to prevent overheating.
  • Yes, the FAN3227TMX is suitable for high-reliability applications. It's built with a robust design, and onsemi provides a comprehensive set of reliability data, including FIT rates and MTBF calculations, to support high-reliability applications.
  • To troubleshoot issues with the FAN3227TMX, start by checking the PCB layout, ensuring that the input and output capacitors are properly placed and that the inductor is properly selected. Then, verify that the input voltage and output voltage are within the recommended ranges. If issues persist, consult the datasheet and application notes for guidance on troubleshooting and debugging techniques.

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