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FAN41501SX - onsemi

Description: Meets 2015 UL943 self-test GFCI requirement; Internal 1-second and 90-minute self-test timers; Minimum external components; Periodic EOL testing without compromising normal GFCI protection; Easily added to existing GFCI applications; Periodic functional testing for key GFCI components: GFCI controller, solenoid, sense transformer, and silicon-controlled rectifier (SCR); Built-in 5 V shunt regulator; Automatic EOL reset capability; Built-in noise filters reduce false EOL signals; Energy-saving system solutio

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PCB Footprints
FAN41501SX - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - FAN41501SX
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3D Models
FAN41501SX - onsemi  - 3D model - SOT23 (6-Pin) - FAN41501SX
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FAN41501SX Details

  • Manufacturer Part Number:

    FAN41501SX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    SOP-6

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -35 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.55 mA

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

FAN41501SX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Monitor the device's junction temperature, input voltage, and output current to ensure they are within the specified limits. Use thermal monitoring and overcurrent protection to prevent damage.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 4.7 μF to 10 μF is recommended to filter the input voltage and reduce noise.
  • Choose an output capacitor with low ESR and high ripple current rating. A 10 μF to 22 μF ceramic capacitor (e.g., X5R or X7R) is suitable for most applications.
  • Keep the switching node (SW) as short and wide as possible, and route it away from sensitive nodes. Use a solid ground plane and a shielded cable to minimize EMI.

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FAN41501SX Overview

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