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FAN48619UC50X - onsemi

Description: True Load Disconnect; Input Voltage Range: 2.7 V to 4.5 V; Output Voltage: 5.0 V; Short-Circuit Protection ; 1000 mA Max. Load Capability; Internal Synchronous Rectification; Three External Components

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FAN48619UC50X - onsemi - PCB symbol
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PCB Footprints
FAN48619UC50X - onsemi PCB footprint - BGA - BGA - 9-Bump, 0.4 mm Pitch, WLCSP
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3D Models
FAN48619UC50X - onsemi - 3D model - BGA - 9-Bump, 0.4 mm Pitch, WLCSP
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FAN48619UC50X Details

  • Manufacturer Part Number:

    FAN48619UC50X

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-9

  • Package Description:

    WLCSP-9

  • Manufacturer Package Code:

    567QW

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.3

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    4.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    S-PBGA-B9

  • Length:

    1.215 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    5.1 V

  • Output Voltage-Min:

    4.9 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA9,3X3,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.619 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    2800 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.215 mm

FAN48619UC50X Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, it is recommended to keep the copper traces as short and wide as possible to minimize thermal resistance.
  • To ensure the device is properly biased during startup, it is recommended to add a pull-up resistor (e.g. 1kΩ) between the EN pin and VIN, and a capacitor (e.g. 1μF) between the EN pin and GND. This will ensure that the device is enabled and biased correctly during power-up.
  • The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the device. It is recommended to use a voltage divider or a clamp circuit to limit the voltage on the EN pin to within the recommended range.
  • The output voltage ripple of the device can be calculated using the following formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency. The output voltage ripple should be kept within the recommended range to ensure stable operation.
  • The recommended input capacitor type is a ceramic capacitor with a value of 10μF to 22μF. The input capacitor should be placed as close as possible to the VIN pin and should have a low ESR to minimize voltage ripple and ensure stable operation.

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FAN48619UC50X Overview

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