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FAN65004C - onsemi

Description: 0.6 V Reference Voltage with 0.67% Accuracy; Dual LDOs for Single Supply Operation and to Reduce Power Loss; External Compensation for Wide Operation Range; Adjustable Soft−Start & Pre−Bias Startup; Wide Input Voltage Range: 4.5 V to 65 V; Switching Frequency: 100 kHz to 1 MHz; Selectable CCM PWM Mode or PFM Mode for Light Loads; Over Current Protection, Thermal Shutdown, Over Voltage Protection, Under Voltage Protection and Short−circuit Protection; Enable Function with Adjustable Input Voltage Under−Volta

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PCB Footprints
FAN65004C - onsemi PCB footprint - Other - Other - PQFN35 6.00x6.00x0.75, 0.5P CASE 483BE ISSUE B
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3D Models
FAN65004C - onsemi  - 3D model - Other - PQFN35 6.00x6.00x0.75, 0.5P CASE 483BE ISSUE B
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FAN65004C Details

  • Manufacturer Part Number:

    FAN65004C

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-35

  • Package Description:

    PQFN-35

  • Manufacturer Package Code:

    483BE

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2019-01-08

  • Manufacturer:

    onsemi

  • YTEOL:

    7.9

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    65 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    S-XQCC-N35

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    35

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC35,.25SQ(UNSPEC)

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1000 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

FAN65004C Frequently Asked Questions (FAQs)

  • A good PCB layout for the FAN65004C should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour connectivity to dissipate heat. Avoid routing high-current traces under the device, and use thermal vias to connect the thermal pad to the heat sink.
  • Optimizing the compensation network involves selecting the right values for the compensation components (R1, R2, C1, and C2). Use the datasheet's recommended values as a starting point, and then adjust them based on your specific application's requirements. You can use simulation tools or empirical methods to fine-tune the compensation network for optimal stability and transient response.
  • The FAN65004C can tolerate a certain amount of input voltage ripple, but excessive ripple can affect its performance and stability. As a general guideline, keep the input voltage ripple below 10% of the nominal input voltage. For example, if the nominal input voltage is 12V, the ripple should be less than 1.2V (peak-to-peak).
  • To ensure the OCP is triggered correctly, make sure the sense resistor (Rs) is properly sized and connected. The sense resistor should be placed close to the device, and its value should be chosen based on the maximum allowed current and the device's OCP threshold. Also, ensure that the PCB layout does not introduce excessive voltage drops or noise that could interfere with the OCP circuitry.
  • The recommended input capacitor type is a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value between 4.7μF and 10μF. The capacitor should be placed close to the device's input pins to minimize inductance and ensure good decoupling. Avoid using electrolytic capacitors, as they may not provide sufficient high-frequency decoupling.

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