Description:Floating Channel for Bootstrap Operation to +1200 V ; Typically 2 A/ 3 A Sourcing/Sinking Current Driving Capability for Both Channels ; Gate Driver Supply (VCC) Range from 12 V to 20 V ; Separate Logic Supply (VDD) Range from 3 V to 20 V ; Extended Allowable Negative VS Swing to -9.8 V for Signal Propagation at VCC=VBS=15 V ; Built-in Cycle-by-Cycle Edge-Triggered Shutdown Logic; Built-in Shoot-Through Protection Logic ; Common-Mode dv/dt Noise Canceling Circuit ; UVLO Functions for Both Channels ; Built-i
A good PCB layout for the FAN73912MX should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour connectivity to dissipate heat. Avoid routing high-current traces near the device to minimize thermal resistance.
To ensure reliable operation across the full temperature range (-40°C to 150°C), follow the recommended operating conditions, and consider the device's thermal derating. Also, ensure proper PCB design, component selection, and thermal management to minimize thermal stress.
For EMI and EMC compliance, ensure proper PCB layout, decoupling, and filtering. Use a common-mode choke or ferrite bead to reduce EMI emissions. Also, follow onsemi's recommended layout guidelines and consider using shielding or a metal can to minimize radiation.
To optimize the FAN73912MX for low-power consumption, ensure proper input voltage selection, and consider using a low-dropout regulator (LDO) or a switching regulator with high efficiency. Also, optimize the device's operating frequency and use power-saving modes when possible.
For testing and measurement, use a 4-point Kelvin connection to minimize measurement errors. Ensure proper probe placement and consider using a thermocouple to measure the device's temperature. Follow onsemi's recommended test procedures and consider using a curve tracer or a parameter analyzer for detailed characterization.
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FAN73912MX Overview
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