Description:High Efficiency through Zero Voltage Switching (ZVS); Up to 300kHz Operating Frequency; Variable Frequency Control with 50% Duty Cycle for Half-bridge Resonant Converter Topology; Fixed Dead Time (350ns) ; Pulse Skipping for Frequency Limit (Programmable) at Light-Load Condition; Protection Functions: Over-Voltage Protection (OVP), Overload Protection (OLP), Over-Current Protection (OCP), Abnormal Over-Current Protection (AOCP), Internal Thermal Shutdown (TSD); Remote On/Off Control using CON Pin
A good PCB layout for the FAN7621SJX should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour connectivity to dissipate heat. Avoid routing high-current traces near the device to minimize thermal resistance.
To ensure reliable startup and shutdown, ensure that the input voltage (VIN) rises and falls slowly (e.g., 10-20 ms) to prevent inrush currents. Also, add a soft-start circuit or a ramp-up circuit to control the output voltage rise time.
Use a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 4.7 μF to 10 μF, depending on the input voltage and output current requirements. This helps to filter input noise and reduce voltage ripple.
Optimize the output filter by selecting the right inductor value and type (e.g., shielded or unshielded) based on the output current and frequency requirements. Use a low-ESR output capacitor (e.g., ceramic or film) with a value between 10 μF to 22 μF to minimize output voltage ripple.
Key considerations for thermal design include ensuring good thermal conductivity between the device and the heat sink, using a thermal interface material (e.g., thermal tape or paste), and providing adequate airflow around the heat sink. A heat sink with a thermal resistance of 10-20°C/W is recommended.
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FAN7621SJX Overview
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