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FBMH2012HM331-T - TAIYO YUDEN

Description: Ferrite Beads HI CUR CHIP BD 0805 330OHMS 25%

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FBMH2012HM331-T - TAIYO YUDEN - PCB symbol
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FBMH2012HM331-T - TAIYO YUDEN PCB footprint - Ferrite Bead Chip - Ferrite Bead Chip - FBMH2012HM331-T
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FBMH2012HM331-T - TAIYO YUDEN - 3D model - Ferrite Bead Chip - FBMH2012HM331-T
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FBMH2012HM331-T Details

  • Manufacturer Part Number:

    FBMH2012HM331-T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TAIYO YUDEN

  • YTEOL:

    7

  • Additional Feature:

    RECTANGULAR CHIP; HIGH IMPEDANCE TYPE

  • Case Code:

    0805

  • Construction:

    Chip Bead

  • DC Resistance-Max:

    0.08 Ω

  • Filter Type:

    FERRITE CHIP

  • Frequency-Max:

    100 MHz

  • Frequency-Min:

    100 MHz

  • Height:

    0.85 mm

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Impedance:

    330 OHM Ω

  • Packing Method:

    TAPE AND REEL

  • Rated Current:

    1.8 A

  • Terminal Finish:

    Matte Tin (Sn)

  • Width:

    1.25 mm

FBMH2012HM331-T Frequently Asked Questions (FAQs)

  • The recommended land pattern for the FBMH2012HM331-T is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask opening of 2.2mm x 1.0mm.
  • The FBMH2012HM331-T has a thermal resistance of 10°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
  • The maximum operating temperature range for the FBMH2012HM331-T is -40°C to 125°C.
  • Yes, the FBMH2012HM331-T is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and ensure proper mounting and soldering.
  • To ensure reliability in a humid environment, ensure that the component is properly sealed and conformally coated. Also, follow the manufacturer's guidelines for moisture sensitivity and storage.

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FBMH2012HM331-T Overview

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