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FDB082N15A - onsemi

Description: RDS(on) = 6.7mΩ ( Typ.)@ VGS = 10V, ID = 75A; High Performance Trench Technology for Extremely Low RDS(on); Low Gate Charge, QG = 64.5nC ( Typ.); Fast Switching Speed; RoHS Compliant; High Power and Current Handling Capability

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FDB082N15A - onsemi  - 3D model
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FDB082N15A Details

  • Manufacturer Part Number:

    FDB082N15A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK-3 / TO-263-2

  • Package Description:

    D2PAK-3

  • Manufacturer Package Code:

    418AJ

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.2

  • Additional Feature:

    ULTRA-LOW RESISTANCE

  • Avalanche Energy Rating (Eas):

    542 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    105 A

  • Drain-source On Resistance-Max:

    0.0082 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    231 W

  • Pulsed Drain Current-Max (IDM):

    420 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDB082N15A Frequently Asked Questions (FAQs)

  • The maximum junction temperature (Tj) of the FDB082N15A is 175°C. It's essential to ensure that the device operates within this temperature range to prevent damage or degradation.
  • To calculate the power dissipation (PD) of the FDB082N15A, use the following formula: PD = (Vds * Ids) + (Vgs * Igs), where Vds is the drain-source voltage, Ids is the drain-source current, Vgs is the gate-source voltage, and Igs is the gate-source current.
  • The recommended gate drive voltage for the FDB082N15A is between 10V and 15V. This ensures proper switching and minimizes power losses.
  • Yes, the FDB082N15A is suitable for high-frequency switching applications up to 1 MHz. However, it's essential to consider the device's switching losses, gate drive requirements, and thermal management to ensure reliable operation.
  • To ensure proper thermal management, use a heat sink with a thermal resistance of less than 1°C/W, and apply a thermal interface material (TIM) with a thermal conductivity of at least 5 W/m-K. Additionally, ensure good airflow around the device and heat sink.

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FDB082N15A Overview

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