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FDB86563-F085 - onsemi

Description: RoHS Compliant ; UIS Capability ; Typical Qg(tot) = 126 nC at VGS = 10V, ID = 80 A ; Qualified to AEC Q101 ; Typical RDS(on) = 1.6 mΩ at VGS = 10V, ID = 80 A

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PCB Footprints
FDB86563-F085 - onsemi PCB footprint - Other - Other - D2-PAK(TO-263)
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FDB86563-F085 - onsemi  - 3D model - Other - D2-PAK(TO-263)
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FDB86563-F085 Details

  • Manufacturer Part Number:

    FDB86563-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-263 2L (D2PAK)

  • Package Description:

    TO-263, D2PAK-3/2

  • Manufacturer Package Code:

    418AJ

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    614 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    110 A

  • Drain-source On Resistance-Max:

    0.0018 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    333 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    250 ns

  • Turn-on Time-Max (ton):

    213 ns

FDB86563-F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a 1-inch square copper pad for heat sinking.
  • Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature (Tj) below 150°C. Monitor the device's thermal resistance (RθJA) and ensure proper airflow.
  • The FDB86563-F085 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and storage. Use an ESD wrist strap or mat, and store the devices in anti-static packaging.
  • Yes, the FDB86563-F085 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions and design guidelines for your specific use case.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check for proper power supply decoupling, and verify that the device is operated within its recommended specifications.

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FDB86563-F085 Overview

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Part Image FDB86563_F085 onsemi

60V, 110A, 1.6mΩ, D2PAK N-Channel PowerTrench®, TO-263 2L (D2PAK), 800-TAPE REEL