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FDBL86063 - onsemi

Description: Typical RDS(on) = 2.0 mΩ at VGS = 10V, ID = 80 A ; Typical Qg(tot) = 73 nC at VGS = 10V, ID = 80 A ; UIS Capability ; RoHS Compliant

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FDBL86063 - onsemi PCB footprint - Other - Other - FDBL86063-F085-1
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FDBL86063 - onsemi  - 3D model - Other - FDBL86063-F085-1
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FDBL86063 Details

  • Manufacturer Part Number:

    FDBL86063

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-LL 8L

  • Manufacturer Package Code:

    100CU

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2020-01-07

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    160 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    240 A

  • Drain-source On Resistance-Max:

    0.0026 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    32 pF

  • JEDEC-95 Code:

    MO-299A

  • JESD-30 Code:

    R-PSSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    357 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    51 ns

  • Turn-on Time-Max (ton):

    53 ns

FDBL86063 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDBL86063 should include a solid ground plane, wide copper traces for power and ground, and a thermal relief pattern under the device. A 2-ounce copper layer is recommended for the top and bottom layers. Additionally, a thermal via array under the device can help to dissipate heat more efficiently.
  • To ensure proper biasing, the FDBL86063 requires a stable input voltage (VIN) between 4.5V and 18V, and a bias voltage (VBIAS) between 2.5V and 5.5V. The bias voltage should be decoupled with a 10nF capacitor to ground, and the input voltage should be decoupled with a 1uF capacitor to ground.
  • The maximum allowable power dissipation for the FDBL86063 is 2.5W. However, this value can be derated based on the ambient temperature and the thermal resistance of the PCB. It's essential to perform thermal calculations to ensure the device operates within its safe operating area.
  • The FDBL86063 is rated for operation up to 150°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the device's thermal characteristics and ensure proper heat sinking and cooling mechanisms are in place for high-temperature applications.
  • To troubleshoot output voltage regulation issues, check the input voltage, bias voltage, and output voltage levels. Ensure that the input voltage is within the recommended range, and the bias voltage is properly set. Also, verify that the output voltage is within the specified tolerance, and the output capacitor is properly sized and selected.

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FDBL86063 Overview

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