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FDBL9401L-F085 - onsemi

Description: Lifetime - N-Channel PowerTrench MOSFET, 40 V, 240 A, 0.9 mΩ

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FDBL9401L-F085 - onsemi - PCB symbol
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PCB Footprints
FDBL9401L-F085 - onsemi PCB footprint - Other - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE O
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3D Models
FDBL9401L-F085 - onsemi - 3D model - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE O
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FDBL9401L-F085 Details

  • Manufacturer Part Number:

    FDBL9401L-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-LL 8L

  • Manufacturer Package Code:

    100CU

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    913 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    300 A

  • Drain-source On Resistance-Max:

    0.00076 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    509 pF

  • JEDEC-95 Code:

    MO-299A

  • JESD-30 Code:

    R-PSSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    429 W

  • Power Dissipation-Max (Abs):

    429 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    412 ns

  • Turn-on Time-Max (ton):

    150 ns

FDBL9401L-F085 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer board with a solid ground plane, placing thermal vias under the device, and using a large copper area for heat dissipation. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and ensure that the device is operated within its specified temperature range. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The FDBL9401L-F085 has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures when handling the device. This includes using an ESD wrist strap or mat, and storing the device in an ESD-protected environment.
  • The FDBL9401L-F085 is designed to operate in a normal humidity environment. However, if the device is to be used in a high-humidity environment, it is recommended to use a conformal coating or potting compound to protect the device from moisture. Additionally, ensure that the device is operated within its specified temperature range to prevent moisture-related issues.
  • The recommended soldering profile for the FDBL9401L-F085 involves using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Ensure that the device is soldered within the specified temperature range to prevent damage.

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FDBL9401L-F085 Overview

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