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FDD9407L-F085 - onsemi

Description: RoHS Compliant ; Typical Qg(tot) = 96 nC at VGS = 10V, ID = 80 A ; UIS Capability ; Typical RDS(on) = 1.4 mΩ at VGS = 10V, ID = 80 A ; Qualified to AEC Q101

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PCB Footprints
FDD9407L-F085 - onsemi PCB footprint - Other - Other - DPAK3 (TO−252 3 LD) CASE 369AS ISSUE O_3
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3D Models
FDD9407L-F085 - onsemi  - 3D model - Other - DPAK3 (TO−252 3 LD) CASE 369AS ISSUE O_3
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FDD9407L-F085 Details

  • Manufacturer Part Number:

    FDD9407L-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-252 3L (DPAK)

  • Manufacturer Package Code:

    369AS

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    128 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain-source On Resistance-Max:

    0.0024 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDD9407L-F085 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure proper biasing, make sure to follow the recommended voltage and current ratings in the datasheet. Also, ensure that the input voltage is within the specified range, and that the output is properly terminated to prevent oscillations.
  • Operating the device beyond the recommended temperature range can lead to reduced performance, decreased reliability, and potentially even device failure. It's essential to ensure the device operates within the specified temperature range to maintain optimal performance and longevity.
  • To troubleshoot issues, start by verifying the PCB layout and ensuring that the device is properly biased. Check for any signs of overheating, and verify that the input and output signals are within the specified ranges. If issues persist, consult the datasheet and application notes for guidance, or contact onsemi support for further assistance.
  • The FDD9407L-F085 has built-in ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent ESD damage. Ensure that the device is handled in an ESD-controlled environment, and that all equipment and tools are properly grounded.

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FDD9407L-F085 Overview

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