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FDD9507L-F085 - onsemi

Description: Typical RDS(on) = 3.3 mΩ at VGS = -10V, ID = -80 A ; Typical Qg(tot) = 110 nC at VGS = -10V, ID = -80 A ; UIS Capability ; RoHS Compliant ; Qualified to AEC Q101

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PCB Footprints
FDD9507L-F085 - onsemi PCB footprint - Other - Other - DPAK3 (TO−252 3 LD) CASE 369AS ISSUE O_3
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3D Models
FDD9507L-F085 - onsemi  - 3D model - Other - DPAK3 (TO−252 3 LD) CASE 369AS ISSUE O_3
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FDD9507L-F085 Details

  • Manufacturer Part Number:

    FDD9507L-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Manufacturer Package Code:

    369AS

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    76 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    259 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain-source On Resistance-Max:

    0.0072 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    227 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    710 ns

  • Turn-on Time-Max (ton):

    21 ns

FDD9507L-F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. Ensure a minimum of 1 oz copper thickness and a thermal via array under the device to facilitate heat dissipation.
  • Monitor the device's junction temperature, drain-source voltage, and drain current to ensure they remain within the specified limits. Implement thermal monitoring and overcurrent protection to prevent damage.
  • Handle the device with ESD-protective materials and equipment. Ensure a grounded wrist strap or mat is used during handling. Avoid touching the device's pins or leads, and store the device in an ESD-protective package when not in use.
  • Yes, the FDD9507L-F085 is qualified for automotive and high-reliability applications. However, ensure you follow the recommended design and manufacturing guidelines, and consult with onsemi's application engineers for specific requirements and support.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60-90 seconds. For rework, use a low-temperature soldering iron (<350°C) and a solder with a melting point below 217°C.

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FDD9507L-F085 Overview

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