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FDMC2523P - onsemi

Description: Max rDS(on) = 1.5Ω at VGS = -10V, ID = -1.5A ; Low Crss ( typical 10pF) ; RoHS compliant ; Low gate charge ( typical 6.2 nC ) ; Fast Switching ; Improved dv / dt capability

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PCB Footprints
FDMC2523P - onsemi PCB footprint - Other - Other - WDFN8 3.3x3.3, 0.65P CASE 511DH ISSUE O
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3D Models
FDMC2523P - onsemi  - 3D model - Other - WDFN8 3.3x3.3, 0.65P CASE 511DH ISSUE O
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FDMC2523P Details

  • Manufacturer Part Number:

    FDMC2523P

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-8

  • Package Description:

    3.30 X 3.30 MM, ROHS COMPLIANT PACKAGE-8

  • Manufacturer Package Code:

    511DH

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.95

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    1.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-F5

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    25 W

  • Pulsed Drain Current-Max (IDM):

    12 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMC2523P Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise coupling.
  • The FDMC2523P requires a bias voltage of 5V ± 10% on the VCC pin. Ensure the bias voltage is stable and noise-free, and that the input voltage is within the recommended range of 2.5V to 5.5V.
  • The FDMC2523P can operate up to 100 MHz, but the maximum frequency depends on the specific application and PCB layout. Consult the datasheet and application notes for more information.
  • The FDMC2523P has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device will be operating at high temperatures or high currents.
  • The FDMC2523P has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure the device is stored in an ESD-safe environment.

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FDMC2523P Overview

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