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FDMC8360L - onsemi

Description: Max rDS(on) = 3.1 mΩ at VGS = 4.5 V, ID = 22 A ; Shielded Gate MOSFET Technology ; 100% UIL Tested ; RoHS Compliant; Max rDS(on) = 2.1 mΩ at VGS = 10 V, ID = 27 A ; Termination is Lead-free ; High performance technology for extremely low rDS(on)

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PCB Footprints
FDMC8360L - onsemi PCB footprint - Other - Other - WDFN8 3.3X3.3, 0.65P CASE 483AW ISSUE A_1
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3D Models
FDMC8360L - onsemi  - 3D model - Other - WDFN8 3.3X3.3, 0.65P CASE 483AW ISSUE A_1
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FDMC8360L Details

  • Manufacturer Part Number:

    FDMC8360L

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-8

  • Package Description:

    ROHS COMPLIANT, POWER 33, 8 PIN

  • Manufacturer Package Code:

    483AW

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    294 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    27 A

  • Drain-source On Resistance-Max:

    0.0021 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-240BA

  • JESD-30 Code:

    S-PDSO-N5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    54 W

  • Pulsed Drain Current-Max (IDM):

    240 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMC8360L Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowable voltage on the input pins is 5.5V, which is the absolute maximum rating. Operating the device above this voltage can cause permanent damage.
  • Yes, but ensure the device is properly sealed and conformal coated to prevent moisture ingress. Follow the recommended storage and handling procedures to prevent damage.
  • Check the input voltage, output load, and PCB layout. Verify that the device is properly soldered and that there are no shorts or opens on the PCB. Consult the datasheet and application notes for troubleshooting guidelines.

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FDMC8360L Overview

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