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FDMC86244 - onsemi

Description: Max rDS(on) = 134 mΩ at VGS = 10 V, ID = 2.8 A ; Low Profile - 1 mm max in Power 33 ; 100% UIL Tested ; RoHS Compliant ; Max rDS(on) = 186 mΩ at VGS = 6 V, ID = 2.4 A

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PCB Footprints
FDMC86244 - onsemi PCB footprint - Other - Other - FDMC8622-3
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3D Models
FDMC86244 - onsemi  - 3D model - Other - FDMC8622-3
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FDMC86244 Details

  • Manufacturer Part Number:

    FDMC86244

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-8

  • Package Description:

    3.30 X 3.30 MM, ROHS COMPLIANT, POWER 33, MLP, 8 PIN

  • Manufacturer Package Code:

    511DR

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5.97

  • Avalanche Energy Rating (Eas):

    12 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    2.8 A

  • Drain-source On Resistance-Max:

    0.134 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-N5

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    26 W

  • Pulsed Drain Current-Max (IDM):

    12 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMC86244 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure that the device is operated within the recommended temperature range (–40°C to 150°C).
  • Consider the frequency range, impedance, and insertion loss when selecting EMI filters. Ensure that the filter is designed to attenuate frequencies above 100 kHz to minimize electromagnetic interference.
  • Use the device's low-power modes, such as the 'Sleep' mode, and optimize the switching frequency to reduce power consumption. Additionally, consider using a low-dropout regulator (LDO) to minimize power losses.
  • Use a high-impedance probe to measure voltage and current. Ensure that the measurement equipment is calibrated and has a high common-mode rejection ratio (CMRR) to minimize noise and interference.

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FDMC86244 Overview

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