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FDMC86320 - onsemi

Description: Max rDS(on) = 11.7 mΩ at VGS = 10 V, ID = 10.7 A; Max rDS(on) = 16 mΩ at VGS = 8 V, ID = 8.5 A; MSL1 robust package design; 100% UIL Tested; RoHS Compliant

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PCB Footprints
FDMC86320 - onsemi PCB footprint - Other - Other - WDFN8 3.3x3.3, 0.65P CASE 511DH ISSUE O
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3D Models
FDMC86320 - onsemi  - 3D model - Other - WDFN8 3.3x3.3, 0.65P CASE 511DH ISSUE O
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FDMC86320 Details

  • Manufacturer Part Number:

    FDMC86320

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-8

  • Package Description:

    3.30 X 3.30 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MLP, 8 PIN

  • Manufacturer Package Code:

    511DH

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.85

  • Avalanche Energy Rating (Eas):

    60 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    10.7 A

  • Drain-source On Resistance-Max:

    0.0117 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    30 pF

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    40 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    45 ns

  • Turn-on Time-Max (ton):

    44 ns

FDMC86320 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDMC86320 involves keeping the high-frequency signals away from the low-frequency signals, using a solid ground plane, and minimizing the length of the traces. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To optimize the FDMC86320 for low power consumption, use the lowest possible supply voltage, reduce the clock frequency, and use the power-down mode when not in use. Additionally, use a low-power oscillator and minimize the number of active circuits.
  • The maximum operating temperature range for the FDMC86320 is -40°C to 125°C. However, the device can be operated at a reduced temperature range of -20°C to 85°C for improved reliability.
  • To troubleshoot issues with the FDMC86320, start by checking the power supply voltage, clock frequency, and signal integrity. Use an oscilloscope to check the signal waveforms and a logic analyzer to check the digital signals. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • The FDMC86320 is not specifically designed for radiation-hardened applications. However, onsemi offers radiation-hardened versions of the device, such as the FDMC86320RH, which is designed for use in high-reliability applications.

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FDMC86320 Overview

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