Description:Max rDS(on) = 37 mΩ at VGS = 6 V, ID = 4 A ; Max rDS(on) = 23 mΩ at VGS = 10 V, ID = 7 A ; 100% UIL Tested ; RoHS Compliant ; Low Profile - 1 mm max in Power 33
A good PCB layout for the FDMC86324 involves keeping the high-frequency signals away from the low-frequency signals, using a solid ground plane, and minimizing the length of the traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
To optimize the FDMC86324 for low power consumption, use the lowest possible supply voltage, reduce the switching frequency, and minimize the output current. Additionally, use the device's built-in power-saving features such as the low-power mode and the shutdown mode.
The maximum operating temperature range for the FDMC86324 is -40°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range.
To ensure EMC with the FDMC86324, use a shielded enclosure, minimize the length of the cables, and use EMI filters on the input and output lines. Additionally, follow good PCB layout practices and use a common mode choke to reduce electromagnetic radiation.
The recommended input capacitor value for the FDMC86324 is 10uF to 22uF, with an X7R or X5R dielectric. The capacitor should be placed as close to the device as possible to minimize the inductance of the traces.
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FDMC86324 Overview
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