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FDMC86570L - onsemi

Description: High performance technology for extremely low rDS(on); Shielded Gate MOSFET Technology ; Max rDS(on) = 4.3 mΩ at VGS = 10 V, ID = 18 A ; Termination is Lead-free ; RoHS Compliant; Max rDS(on) = 6.5 mΩ at VGS = 4.5 V, ID = 15 A

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PCB Footprints
FDMC86570L - onsemi PCB footprint - Other - Other - PQFN8 3.3X3.3, 0.65P CASE 483AW ISSUE O
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3D Models
FDMC86570L - onsemi  - 3D model - Other - PQFN8 3.3X3.3, 0.65P CASE 483AW ISSUE O
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FDMC86570L Details

  • Manufacturer Part Number:

    FDMC86570L

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-8

  • Manufacturer Package Code:

    483AW

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    253 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    18 A

  • Drain-source On Resistance-Max:

    0.0043 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-240BA

  • JESD-30 Code:

    S-PDSO-N5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    54 W

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMC86570L Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, it's recommended to keep the input voltage within the recommended operating range of 3.3V to 5V for reliable operation.
  • Yes, but ensure the device is properly sealed or coated to prevent moisture ingress. Follow the recommended storage and handling procedures to prevent damage from moisture.
  • Check the power supply voltage, ensure proper connections, and verify the enable pin is properly configured. Also, check for any short circuits or damage to the device or PCB.

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FDMC86570L Overview

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