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FDMS2572 - onsemi

Description: Typ Qg = 31nC at VGS = 10 V; Max rDS(on) = 47mΩ at VGS = 10V, ID = 4.5A; Optimized efficiency at high frequencies ; Low Miller Charge ; RoHS Compliant ; UIS Capability (Single pulse and Repetitive pulse)

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PCB Footprints
FDMS2572 - onsemi PCB footprint - Other - Other - WDFN8 5x6, 1.27P CASE 506DP ISSUE O
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3D Models
FDMS2572 - onsemi  - 3D model - Other - WDFN8 5x6, 1.27P CASE 506DP ISSUE O
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FDMS2572 Details

  • Manufacturer Part Number:

    FDMS2572

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-8

  • Package Description:

    ROHS COMPLIANT, POWER56, 8 PIN

  • Manufacturer Package Code:

    506DP

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    27 A

  • Drain-source On Resistance-Max:

    0.053 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-XDSO-N8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.8 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMS2572 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise coupling.
  • Ensure the input voltage is within the recommended range (2.7V to 5.5V) and the bias voltage (VBIAS) is set to 1.65V. Also, ensure the input impedance is matched to the source impedance.
  • The maximum power dissipation of FDMS2572 is 250mW. Ensure proper thermal management to prevent overheating.
  • Use a low-pass filter (e.g., RC filter) at the output to filter out high-frequency noise and interference. Also, ensure proper grounding and shielding of the PCB.
  • Yes, but ensure the operating temperature is within the recommended range (-40°C to 125°C). Derate the power dissipation accordingly to prevent overheating.

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FDMS2572 Overview

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