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FDMS2734 - onsemi

Description: Optimized efficiency at high frequencies ; Low Miller Charge ; Max rDS(on) = 130 mΩ at VGS = 6 V, ID = 1.7 A ; Max rDS(on) = 122 mΩ at VGS = 10 V, ID = 2.8 A ; RoHS Compliant

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PCB Footprints
FDMS2734 - onsemi PCB footprint - Other - Other - WDFN8 5x6, 1.27P CASE 506DP ISSUE O_1
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3D Models
FDMS2734 - onsemi  - 3D model - Other - WDFN8 5x6, 1.27P CASE 506DP ISSUE O_1
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FDMS2734 Details

  • Manufacturer Part Number:

    FDMS2734

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-8

  • Package Description:

    MO-229, 8 PIN

  • Manufacturer Package Code:

    506DP

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.97

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    250 V

  • Drain Current-Max (ID):

    2.8 A

  • Drain-source On Resistance-Max:

    0.122 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N5

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    78 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMS2734 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Use a heat sink, ensure good airflow, and consider using a thermal interface material (TIM) to improve heat transfer. Also, follow the recommended operating conditions and derating guidelines.
  • The maximum allowed voltage on the VIN pin is 28V, but it's recommended to keep it below 24V for reliable operation and to prevent damage to the internal voltage regulator.
  • Ensure that the VIN pin is powered up before the VCC pin, and that the VCC pin is powered down before the VIN pin. This is critical to prevent damage to the device.
  • A 1uF to 10uF ceramic capacitor is recommended for the VCC pin bypass capacitor, depending on the specific application and noise requirements.

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FDMS2734 Overview

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