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FDMS7694 - onsemi

Description: MSL1 robust package design ; Max rDS(on) = 8 mΩ at VGS = 10 V, ID = 14 A ; Advanced Package and Silicon combination for low rDS(on) and high efficiency ; RoHS Compliant ; Next generation enhanced body diode technology, engineered for soft recovery ; 100% UIL tested ; Max rDS(on) = 13 mΩ at VGS = 4.5 V, ID = 11 A

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Symbol
FDMS7694 - onsemi - PCB symbol
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PCB Footprints
FDMS7694 - onsemi PCB footprint - Other - Other - PQFN8 5X6, 1.27P CASE 483AE ISSUE C
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3D Models
FDMS7694 - onsemi - 3D model - Other - PQFN8 5X6, 1.27P CASE 483AE ISSUE C
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FDMS7694 Details

  • Manufacturer Part Number:

    FDMS7694

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-8

  • Package Description:

    ROHS COMPLIANT, POWER 56, 8 PIN

  • Manufacturer Package Code:

    483AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    21 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    13.2 A

  • Drain-source On Resistance-Max:

    0.0095 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-240AA

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    27 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMS7694 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDMS7694 involves keeping the high-frequency traces short and away from the edges of the board, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and placing it close to the device can help reduce EMI.
  • To optimize the FDMS7694 for low standby power consumption, ensure that the EN pin is properly biased to turn off the device when not in use. Also, minimize the voltage on the VIN pin and use a low-quiescent-current LDO regulator to power the device. Furthermore, consider using a low-power mode or shutdown mode if available.
  • The maximum allowed voltage on the VIN pin of the FDMS7694 is 18V. Exceeding this voltage can cause permanent damage to the device.
  • To ensure the FDMS7694 is stable and reliable, follow the recommended operating conditions, ensure proper thermal management, and use a stable input voltage. Additionally, consider using a soft-start circuit to reduce inrush current and prevent voltage drops during startup.
  • The FDMS7694 is rated for operation up to 150°C. However, the device's performance and reliability may degrade at high temperatures. Ensure proper thermal management and consider using a heat sink or thermal interface material to maintain a safe operating temperature.

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FDMS7694 Overview

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