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FDP085N10A_F102 - onsemi

Description: FDP085N10A_F102 N-Channel MOSFET Transistor, 96 A, 100 V, 3-Pin TO-220 Fairchild

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FDP085N10A_F102 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - FDP085N10A_F102-
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FDP085N10A_F102 Details

  • Manufacturer Part Number:

    FDP085N10A_F102

  • Brand Name:

    ON Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT PACKAGE-3

  • Manufacturer Package Code:

    TO220T03

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Additional Feature:

    ULTRA-LOW RESISTANCE

  • Avalanche Energy Rating (Eas):

    269 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    96 A

  • Drain-source On Resistance-Max:

    0.0085 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    188 W

  • Pulsed Drain Current-Max (IDM):

    384 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDP085N10A_F102 Frequently Asked Questions (FAQs)

  • The maximum junction temperature (Tj) for the FDP085N10A_F102 is 150°C. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
  • Proper cooling can be achieved by using a heat sink with a thermal resistance of less than 1°C/W, and ensuring good airflow around the device. The heat sink should be attached to the device using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K.
  • The recommended gate drive voltage for the FDP085N10A_F102 is between 10V and 15V. However, the optimal gate drive voltage may vary depending on the specific application and operating conditions.
  • Yes, the FDP085N10A_F102 is suitable for high-frequency switching applications up to 100 kHz. However, the device's performance and reliability may be affected by high-frequency operation, and additional considerations such as gate drive voltage, dead time, and layout parasitics should be taken into account.
  • Overvoltage protection can be achieved using a voltage clamp or a zener diode. Overcurrent protection can be achieved using a current sense resistor and a comparator or a dedicated overcurrent protection IC. Additionally, a fuse or a circuit breaker can be used to protect the device from excessive current.

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